Dallas, TX / CRWE PRESS RELEASE / April 11, 2022 - According to the recent study the advanced IC packaging market is projected to reach an estimated $50.1 billion by 2026 from $31.6 billion in 2020, at a CAGR of 8% from 2020 to 2026. Growth in this market is primarily driven by growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.

Browse 74 figures / charts and 41 tables in this 138 -page report to understand trends, opportunities and forecast in advanced IC packaging market by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).

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“Flip-chip market is expected to remain the largest segment during the forecast period.”

Based on packaging type, the advanced IC packaging market is segmented into flip-chip, fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D. Lucintel forecasts that the flip-chip market is expected to remain the largest segment over the forecast period due to rise in demand for high speed portable devices and increasing need for high packaging density.

“Within the advanced IC packaging market, the consumer and communication segment is expected to remain the largest end use industry”

Based on end use industry, the consumer and communication segment is expected to witness the largest coating over the forecast period increasing demand for smartphones, connected and high performance consumer devices with AI technology, and demand for high performance computing are driving the demand for advanced IC packaging in the consumer and communication market.

“Asia pacific will dominate the advanced IC packaging market in near future”

Asia Pacific is expected to be the largest region with the highest growth over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) are driving the demand for advanced IC packaging market in this region.

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Major players of advanced IC packaging market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Amkor, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and Samsung are among the major advanced IC packaging providers.

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/advanced-ic-packaging-market.aspx or helpdesk@lucintel.com